Hi all,
My model is heat transfer in solid with the air effect. The big block outside is air and in it is a device, it is a silicon wafer with a heat source on it. If I have to use assembly mode, how can I set boundary conditions for the faces of the inner device.
Thank you for your help!
My model is heat transfer in solid with the air effect. The big block outside is air and in it is a device, it is a silicon wafer with a heat source on it. If I have to use assembly mode, how can I set boundary conditions for the faces of the inner device.
Thank you for your help!