Hi All,
I am presently working on a project that involves the simulation of a micro-channel heat sink on COMSOL, i have gone through various literatures and have also followed the microchannel turorial COMSOL provided. i am however having problems with my model, in that it records a rather too high temperature (above 1000k) with applicatin of power as little as 50W. and i am yet to figure out where the problem is emanating from. the size of the silicon chip is 1cmx1cm, with approximately 90 signle rectangular microchannel at the back, a channel height 300microns, and width 50microns, the side walls are 50 microns as well. I made use of a heat source to serve as the heating element of the chip, the materials are silicon and water. with this dimensions i am suppose to get an approximate cooling density of around 790W/cm-sqr. Is their anyone in the house that could please help in looking into my design.
thanks.
I am presently working on a project that involves the simulation of a micro-channel heat sink on COMSOL, i have gone through various literatures and have also followed the microchannel turorial COMSOL provided. i am however having problems with my model, in that it records a rather too high temperature (above 1000k) with applicatin of power as little as 50W. and i am yet to figure out where the problem is emanating from. the size of the silicon chip is 1cmx1cm, with approximately 90 signle rectangular microchannel at the back, a channel height 300microns, and width 50microns, the side walls are 50 microns as well. I made use of a heat source to serve as the heating element of the chip, the materials are silicon and water. with this dimensions i am suppose to get an approximate cooling density of around 790W/cm-sqr. Is their anyone in the house that could please help in looking into my design.
thanks.