Dear All
I'm a new for COMSOL.
the case that i'm facing is a flip chip process.
after read several samples, still could not figure it out what model/physics should to be used.
hope to get some help from here.
basically the process is something like below:
1. solder is at molten status with heating applied to its molten temp;
2. apply force to the upper surface of the molten solder
3. solder spreads with the temp and force are keeping applied;
4. solder cool down and solidified with temp removed.
5. solder joint formed.
6. result display the spread solder's area and thickness.
these processes may need to use several modules and coupling between them.
appreciate much for any suggestion.
suggestion for paper/tutorial or method also welcome.
Regards & thanks.
AB
I'm a new for COMSOL.
the case that i'm facing is a flip chip process.
after read several samples, still could not figure it out what model/physics should to be used.
hope to get some help from here.
basically the process is something like below:
1. solder is at molten status with heating applied to its molten temp;
2. apply force to the upper surface of the molten solder
3. solder spreads with the temp and force are keeping applied;
4. solder cool down and solidified with temp removed.
5. solder joint formed.
6. result display the spread solder's area and thickness.
these processes may need to use several modules and coupling between them.
appreciate much for any suggestion.
suggestion for paper/tutorial or method also welcome.
Regards & thanks.
AB