I'm modelling a spiral inductor on a PCB. The height of the copper layer is only 70 µm. Between the turns is an air gap of 200 µm. The inductor is sourrunded by an air domain and an infinite element domain.
The copper can meshed fast with a free Triangular mesh and a swept mesh. But I'm having problems with meshing the sourrunding air. I tried various mesh sizes but none of them worked.
I read that i might be possible to reduce the dimensions of the copper and build a layer with a zero thickness. But I need also the ohmic resistance of the inductor. So i think this not a solution.
Please help me with this problem.